Murrietta Circuits Invests in New Plating Facility

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Murrietta Circuits, a turnkey supplier of electronic manufacturing services based in Anaheim, Calif., has installed a new IPS (Integrated Process Systems) plating line that includes DC tanks as well as pulse plating tanks with rectifiers from Baker Technology Associates, Inc. This system will allow Murrietta Circuits to perform high aspect ratio plating up to 15-1. In addition, the company purchased a new Plasma Etch System (MKII) for etch-back and de-smear, and a Chemcut high-pressure deburr machine. In this upgrade, Murrietta also set up an entirely new waste treatment system with fume scrubbers.

Back in 2011, Murrietta Circuits announced plans to start-up a new electroless copper plating line, with reverse pulse rectifiers for high aspect ratio plating. The move was designed to increase its pwb plating capabilities—and capacity—to keep up to date with today’s high density and blind and buried via technology. “This has been a long time coming,” said Albert Murrietta’s co-owner and vice president of manufacturing. “In the past we have been focused on our assembly operations, which is a significant part of our Integrated Solutions offering. In fact, our assembly business has grown by 450% in recent years. So now it was time to beef up our manufacturing facility. With the investment in a new plating line and other equipment, we now are able to handle all of our customers’ needs, including military and aerospace as well as high tech commercial work, giving us a true Integrated Solutions (design, manufacturing and assembly) offering.”

Ray Young, Murrietta’s manufacturing facility general manager, said: “This is now one of the finest manufacturing facilities that I have ever worked in. It is very well designed and equipped so that we can provide our customers with everything they need for their individual PCB needs as well as their complete Integrated Solutions needs.”

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